Multilayer flexible circuit board - List of Manufacturers, Suppliers, Companies and Products

Multilayer flexible circuit board Product List

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP material! Introducing our manufacturing achievements with a product size of 1300mm.

We would like to introduce our company's substrate manufacturing achievements. We have produced ultra-long multilayer LCP substrates with a product size of 1300mm. Our features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible substrate made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Processes: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Substrate Size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment

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Multi-layer flexible printed circuit board (multi-layer FPC) "Ultra-thin flexible multi-layer FPC"

Multi-layer flexible printed circuit board (multi-layer FPC) "Ultra-thin flexible multi-layer FPC"

Achieving a 40% reduction in thickness! Introducing a flexible, low-rebound, and excellent multi-layer flexible substrate.

The "Ultra-thin Flexible Multi-layer FPC" is a multi-layer flexible substrate that achieves a thinner profile while maintaining the same wiring density as standard multi-layer FPCs. It enables bending wiring in narrow spaces, which was previously difficult, and contributes to the ongoing lightweight and compact development of digital electronic devices. It can be applied to wearable devices used in various fields, including mobile devices, medical and nursing care, robotics, sports, and healthcare. 【Features】 ■ Achieves a 40% reduction in thickness ■ Uses polyimide as the substrate, ensuring sufficient reliability while being thin ■ Excellent embedability due to its thin, flexible, and low-rebound characteristics *For more details, please refer to the PDF document or feel free to contact us.

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